Smart Card Module Bonding Machine YCB-2

Smart Card Module Bonding Machine 1.Applicable material:Plastic PVC, ABS, PETG etc 2.Applicable material:0.10-0.15mm.

  For watching the video clip of this machine, please visit our official website:

http://www.tj-lk.cn

 http://www.tj-lk.cn/cpinfo.asp?id=539

Smart Card Module Bonding Machine YCB-2   

This machine adopts high-speed servo system and highly stable and precise spot welder with HF contravariant resistance, which is characterized with high precision, high stability and high speed.

Technical parameters

Applicable layout: 3×10, 4×10Applicable material (plastic material) :Plastic material like PVC, ABS, PETG etc.Applicable material (copper wire) :0.10-0.15mmNumber of weld head:3 or 4Work table: 2 worktables 320×500 or 410×520Control: PLC + touch screenSpot welder:3 or 4 sets, 9kVACompressed air:0.6MPaAir consumption:15 liter/min.Power supply: AC380V, 3-phase with 5-wirePower:1.5kWWeight:500kgDimension: L1850×W960×H1750

 Smart Card Module Bonding Machine  YCB-1   

 Smart Card Module Bonding Machine  YCB-2

Our machines include:

contactless IC card processing equipment( Inlay machines),card laminator,card punching machine,SIM card making machines,special shape card punching machine (3-tag machine),hot stamping machine,magnetic strip spot bonding machine,spot bonding machine,personalized Data equipments, etc.

 please visit our official website: http://www.tj-lk.cn 

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Smart Card Module Bonding Machine YCB-2